Page 23 - Vectrawave - eCatalog
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Head Office : Z.I. des Loges, rue de la Croix Blanche - 78350 Les Loges en Josas - France
Website :
• Phone : + 33 (0)619 870 560 • Fax : +33 (0)139 564 012 • Mail :
VectraWave Proprietary information subject to change without notice
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MMIC : VWA 50036 ACAA
DATA SHEET
VWA
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Head Office : Z.I. des Loges, rue de la Croix Blanche - 78350 Les Loges en Josas - France
+ 33 (0)619 870 560
+33 (0)139 564 012
mail :
VWA 50036 AC xx DS Rev2.0
VectraWave Proprietary information subject to change without notice
Sept. 12
p 6 /6
Bonding Pad Drawing
MMIC Steps on the wafer are 4.5 and 4.1 mm along X and Y coordinated respectively, dicing typically reduce
the die by 30um.
Figure 7 : Pad layout drawing
Handling
This product is sensitive to electrostatic discharge and should not be handled except at a static free workstation. Take
precautions to prevent ESD; use wrist straps, grounded work surfaces and recognized anti-static techniques when
handling the
VWA-50036-AC-AA
MMIC.
VWA_50036_ACxx_DS_Rev2.0.pdf
