About us
Our companyCompany Mission
VectraWave is an innovative European company designing, developing and marketing :
- Smart Broad band Amplifiers, Integrated system solutions
- Key Integrated Systems Solutions
- RFIC, MMIC, SOC
- MCM, SiP
VectraWave mission is to develop differentiated, cost effective, high performance and low power consumption IC solutions for :
- Equipment manufacturers
- RF & Microwave Equipments
- Optical Communication
Background
VectraWave was founded in 2006 to provide OEM’s with a partner with well-rounded expertise in the most advanced Microwave, RF and Optical/RF technologies and design techniques. This unique combination of engineering and manufacturing depth is the cornerstone of component designs that enable improved system performance, lower manufacturing cost, and accelerated time to market.
VectraWave is focused on DC to millimeter-wave single function to highly integrated semiconductors and ASICs, system-in-package (SIP) modules, and multi-chip modules (MCM) for microwave, RF and lightwave applications. SiP technology is being embraced as an ideal solution for applications that demand miniaturization with sophisticated functionality. SiP also provides the added benefit of compatibility with die design changes and integration of various die technologies (e.g., Si, GaAs, SiGe, SOI, MEMS).
The core of the company is an international team of respected technologists with proven experience in the spectrum of disciplines involved with the design and manufacturing of high performance, high reliability complex integrated products.
Capabilities
VectraWave’s distinction in the market is specialization in development of innovative semiconductors and packaging solutions from a system perspective. This approach begins with a clear understanding of the customer’s critical parameters. Because VectraWave’s engineering team brings a strong working knowledge of a wide variety of technologies and techniques, the resulting product designs are fully optimized for the customer’s system performance specifications and manufacturing cost considerations.
With core competencies in circuit design and expertise in processes such as CMOS, SiGe, SOI and GaAs, VectraWave is qualified to meet the industry demand for higher levels of integration, cost-effectiveness and better electrical performance.
In addition to custom product solutions, VectraWave is developing its offering of off-the-shelf components and subsystems for the communications (hi-speed optical, broadband wireless, and satellite), point-to-point and point-to-multipoint radios, aerospace and defense, and test equipment applications.
Partners
VectraWave has established working relationships with 4 foundries with competencies in SiGe, GaAs, CMOs and SOI. The company has partnerships in place in manufacturing and packaging, allowing the company to select the most effective combination of process and production partner for each project.
Applications
Communications (Hi-speed optical, Broadband Wireless, Satellite)
Aerospace and Defense (Radar, ECM)
Broadband Test Equipment
Point-to-Point and Point-to-Multipoint radios
Millimeter-wave Systems
Quality
VectraWave products are designed and manufactured to the highest standards. We qualify and maintain strict control over our suppliers, which results in high reliability, exceptional performance, for guaranteed delivery and customer satisfaction
As a result, VectraWave product offering is a variety of innovative components and subsystems for the Communications (Broadband Wireless, Satellite and Optical), Point-to-Point and Point-to-Multipoint Radios, Aerospace and Defense, and Broadband Test Equipment applications.
Organization Chart
Yan Haentjens
Co-Founder and President
Board Member
Before starting VectraWave, Yan Haentjens was Co-Founder and President/CEO of DA-LightCom, a start-up company, founded in 2001, in the business of designing ultra-wideband IC devices for high speed communications. In 2005 DA-LightCom was acquired by Highwave.
His background includes executive management, over 20 years in international sales and marketing in the field of microwave and RF/optical components and instrumentation.
Yan began his career working as a design engineer in radar at Thomson CSF. He holds various patents in the microwave industry including works on a 10 watt X-Band solid state pulse transmitter and RF front end. In 1983 he joined a leading distributor in Europe as a product manager for microwave and optical components, and in 1986 he assumed the position of director of sales and marketing for the GIGA Group, a leading manufacturer of microwave instrumentation and modules. After Advantest acquired GIGA Group in 1989, he moved to Germany as a European product manager for Wavetek Inc.
In 1992, Yan Haentjens held the position of sales manager at MB Electronique, and in 1999 joined Jenoptec, a manufacturer of telecom and optical components, as director of sales and marketing.
Yan Haentjens is a CNAM Engineer.
Alain Le Borgne
Co-Founder and VP of Technologies
Board Member
Alain has more than 33 years of experience in the microwave and microelectronic industry. He joined the industry as a research engineer designing waveguide components and microwaves antennas.
For seven years he served as senior engineer at VELEC SEFAT, where he developed TV transmissions antennas, terrestrial links, satellites receivers, and TV transmissions on fiberglass networks. He was responsible for the design and management of the microelectronic laboratory there.
In 1984 he created ”MICRONIC”, a provider of custom services in microelectronic thin-film circuits and microwaves. He was the chairman of that company until 2006. During this time he was active in the academic community and taught university courses in microelectronic, microwaves and electronic component technology.
He received his PhD from Lille University, working in the “Centre Hyper-frequences et Semiconducteurs”.
Alain Le Borgne is member of IMAPS.
Hervé Cam
Co-Founder and Chief Technical Officer
Herve Cam is responsible for the definition at system level and the design of integrated and complex functions using silicon-based technologies. His primary domain of expertise is RF for system and circuit aspects. He has designed various chips covering the DC to mmwave using RF CMOS, BiCMOS (silicon and SiGe), SOI and InP.
Prior to joining VectraWave, he was the design manager in ACCO, for offices in France and the US. He has been responsible for the design and system definition of complex chips like GSM and GSM transceivers, power controllers, and is directly involved in the design itself.
Herve has also worked for MATRA NORTEL communications as a system engineer in the Domestic Terminal division where he was in charge of the complete development of telephone sets, from component selection through production follow-up. His skills cover circuit design to integration into the final application.
Herve Cam received his PhD in 1994 and is also Engineer in Electronics from the ENST (Ecole National Supérieure des Télécommunications), Brest, France.
Herve Cam is a IEEE member.
Gerald Chretien
Co-Founder and Operations Director
Gerald Chretien holds program management, quality and manufacturing responsibilities for VectraWave. He spent more than 26 years in the telecommunication and optoelectronic industries in a variety of development, product management and manufacturing leadership roles.
Most recently, he served as site manager and operations manager for Highwave. He also served as director of product marketing for Avanex and Alcatel Optronics, where he oversaw the active, passive and optical interfaces product lines, developed and extended product market position in pump laser and optical amplifiers.
Earlier positions included site director, product marketing director, product line manager, and development team leader. Prior to joining VectraWave, Mr. Chrétien held several positions at Alcatel, Thales and Philips.
Gerald Chretien holds an engineering degree from ISEP (Institut Supérieur d’Electronique de Paris) in France.
Abdenour Chelouah
Co-Founder and Engineering Manager
Abdenour Chelouah received the Dipl.-Ing. degree in telecommunications from the University of Algiers, Algeria, in 1990, the D.E.A. degree in microwave design and telecommunications, and the Ph.D. degree in GaAs MMIC Design from the University of Paris VI in 1992 and 1997 respectively.
Since 1997, he has been with the research laboratory of Ecole Nationale Supérieure de Techniques Avancées ENSTA-DGA, Paris, France, as a postgraduate research engineer for the European project ESPRIT 27001-ADAMO (Adaptative Antennas for Mobiles). He was involved in developing innovative beam switching smart antenna for HYPERLAN terminals.
In 2000, he joined the RF hardware group of PHILIPS Consumer Communications, Montrouge, France, and contributed in the development process of a new 3G dual-mode cellular phone, designing mainly the UMTS receiver section.
From 2002 to 2006, he worked at Da-LightCom, acquired by HaighWave in 2005, Lannion, France, where he functioned as a project and team leader for the development and design of ultra-wideband MMIC and IC devices for digital high speed optical communications.
In 2006, he was recognized in the French competition of innovative business start-ups in the category "creation-development", for accomplishment in micro-system in package (MSIP) microwave signal processing. Since May 2006, Abdenour has been with VectraWave in the capacity of project and team manager in MMIC design and RF & microwave engineering activity.
Christian Le Nôtre
Senior Engineer, MCM Manager
Christian Le Nôtre has more than 25 years of experience in the microwave and microelectronic industry. He joined the industry as a research engineer designing microwaves components.
Christian has worked for DASSAULT ELECTRONIQUE, THOMSON-CSF DETEXIS and THALES AIRBORNE SYSTEMS as a senior engineer, where he was in charge of the complete development from component selection through industrialization follow-up, of MCM (Multi-chips modules) and sub-systems for ECM (Broadband), seekers (Narrowband) and spatial applications, including microwaves and digital functions. His skills cover circuit design to integration into the final application.
He has also worked on thin film technology and was in charge of studies prior to development for spatial applications.
Christian Le Nôtre holds an engineering degree from ENSEEIHT (Ecole Nationale Supérieure d’Electrotechnique, d’Electronique, d’Informatique et d’Hydraulique de Toulouse), Electronic department, in France.
