Technology
Vectrawave technologyVectraWave is pleased to provide its best capabilities for designing the best cost effective Microwave Integrated circuit solution for your equipment. VectraWave is mastering 3 technologies of integration: MMIC (Microwave Monolithic Integrated Circuit), RFIC (Radio Frequency Integrated Circuit) and MCM (Multi-Chip Module) or SiP (System in Package). This service can start from the early stage (defining the specification of the final device) to organizing and supplying the final product (according to our customer requirements).
Portfolio
VectraWave is a solution provider for integrated electronic in high frequency microwaves and optoelectronic for telecommunications over radio or optical fibre, in the field of civil, military or medical market. VectraWave is an independent company, delivering “OEM” and proprietary Integrated Circuits and System In Package or Multi-Chip-Modules improving performances and costs of communication system equipment, by offering components based on SiGe, GaAs,GaN, micro-electronics and packaging advanced technologies.
MMIC & RFIC
Technologies & Foundries
Pending of the application and quantities, VectraWave will be pleased to introduce to its foundry partners for
- MMIC Technologies (Microwave Monolithic Integrated Circuit)
- WIN Semiconductors,
- Ommic,
- UMS,
- etc
- RFIC Technologies (Radio Frequency Integrated Circuit)
- TowerJazz,
- Peregrine,
- etc.
On GaAs Technologies, VectraWave can design devices up to 90 GHz using Low Noise or Power foundry processes from 0,5µm up to 0,15µm or lower. The devices can include switches, phase shifters and attenuators (analogue and digital), filters, oscillators, low noise, medium power, wide band and high power amplifiers.
On GaN Technologies, VectraWave can design devices based on the available technologies.
Using Silicon Germanium (SiGe) BiCMOS process technologies, VectraWave can design high speed logic integrated circuits, as well as analogue mixed signal integrated circuits.
Our Design process
According to the requirements, we will adjust our process for fitting the application. Generally two design cycles, separated by the fabrication and characterization of the device, are necessary for adjusting and reaching the targeted specifications.
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| 43GHz Wide Band Amplifier Die Size: 2970 X 1520 X 100 μm | 6 Bits X Band Digital phase Die Size: 4320 X 1520 X 100 μm | High Power Amplifier Die Size: 4100 X 4400 X 100 μm |
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| 43Gbps D Flip Flop Die Size: 1000X 1000 μm | NRZ to RZ/DPSK 30Gbps Coder Die in QFN 3X3 mm | 30GHz Linear Power controller Die Size: 1000 X 1000 μm |
Multi-Chip Module & System in Package
Technologies of packaging
Pending of the application and quantities, VectraWave will design and choose the best integrated circuit solution, and define in accordance to the requirement, the appropriate suppliers and sub-contractors for the production.
VectraWave packaging expertises include the Electromagnetic and thermal simulation for complex device.
Surface Mount package solution can be provided up and above 40GHz.
RF packaging can be coupled to Optical packaging for communication, Avionic and space applications.
Packaging
To address customer’s system requirements for size and cost, VectraWave is developing proprietary packages like Lead Chip Carriers, and connectorized modules, as well as working with packages like QFN.
System in Package (SiP) is a modular design approach offering unprecedented flexibility in product development. The customer benefits from a faster time-to-market, reduced cycle time for system design, low development risk, flexibility, tuned functional performance, and ultimately—lower overall cost of ownership.
The ability to integrate different technologies and to reduce total product cost and time to market are the prime drivers for SiP packaging. For the markets that require very high performance, SiPs have enabled the rapid integration of technologies like SiGe, GaAs, CMOS, SOI and passive devices into single package solutions that are not possible today with single-chip solutions. In most cases, this approach has also reduced product costs, allowing systems to be partitioned into the most cost-effective blocks.
SiP technology is an ideal solution in markets that demand smaller size with increased functionality. However, SiP has the added benefit of compatibility with die design changes and integration of various die technologies.
Processes
In order to meet customers’ requirements for cost and performances, VectraWave is designing semiconductors using BiCMOS, CMOS, GaAs and SOI processes. We have experience working with leading foundries like Towell Jazz Technologies, Win Semiconductor, UMS, IBM and Peregrine.
