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Integrated Components and Subsystems for Microwave, RF and Light-Wave

Design Service.

 Technologies & Foundries

Pending of the application and quantities, VectraWave will be pleased to introduce to its foundry partners for

  • MMIC Technologies (Microwave Monolithic Integrated Circuit)
    • WIN Semiconductors,
    • Ommic,
    • UMS,
    • etc
  • RFIC Technologies (Radio Frequency Integrated Circuit)
    • TowerJazz,
    • Peregrine,
    • etc.

On GaAs Technologies, VectraWave can design devices up to 90 GHz using Low Noise or Power foundry processes from 0,5µm up to 0,15µm or lower. The devices can include switches, phase shifters and attenuators (analogue and digital), filters, oscillators, low noise, medium power, wide band and high power amplifiers.
On GaN Technologies, VectraWave can design devices based on the available technologies.

Using Silicon Germanium (SiGe) BiCMOS process technologies, VectraWave can design high speed logic integrated circuits, as well as analogue mixed signal integrated circuits.

Our Design process

 

According to the requirements, we will adjust our process for fitting the application. Generally two design cycles, separated by the fabrication and characterization of the device, are necessary for adjusting and reaching the targeted specifications.

Vectrawave - Design process

Vectrawave – Design process

 

MMIC examples

43GHz Wide Band Amplifier

43GHz Wide Band Amplifier – Die Size: 2970 X 1520 X 100 μm

6 Bits X Band Digital phase

6 Bits X Band Digital phase – Die Size: 4320 X 1520 X 100 μm

High Power Amplifier

High Power Amplifier – Die Size: 4100 X 4400 X 100 μm

RFIC examples

43Gbps D Flip Flop

43Gbps D Flip Flop – Die Size: 1000X 1000 μm

NRZ to RZ/DPSK 30Gbps Coder

NRZ to RZ/DPSK 30Gbps Coder – Die in QFN 3X3 mm

30GHz Linear Power controller

30GHz Linear Power controller – Die Size: 1000 X 1000 μm

 Technologies of packaging

Packaging Solutions

Packaging Solutions

 

Pending of the application and quantities, VectraWave will design and choose the best integrated circuit solution, and define in accordance to the requirement, the appropriate suppliers and sub-contractors for the production.

VectraWave packaging expertises include the Electromagnetic and thermal simulation for complex device.

 

RF packaging can be coupled to Optical packaging for communication, Avionic and space application.

Surface Mount package-solution

Surface Mount package-solution

Measure on a QFN transition (included test board)

Measure on a QFN transition (included test board)

Multi-Chip Module System in Package

Multi-Chip Module System in Package

Multi-Chip Module System in Package

Multi-Chip Module System in Package

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