Technologies & Foundries
Pending of the application and quantities, VectraWave will be pleased to introduce to its foundry partners for
- MMIC Technologies (Microwave Monolithic Integrated Circuit)
- WIN Semiconductors,
- RFIC Technologies (Radio Frequency Integrated Circuit)
On GaAs Technologies, VectraWave can design devices up to 90 GHz using Low Noise or Power foundry processes from 0,5µm up to 0,15µm or lower. The devices can include switches, phase shifters and attenuators (analogue and digital), filters, oscillators, low noise, medium power, wide band and high power amplifiers.
On GaN Technologies, VectraWave can design devices based on the available technologies.
Using Silicon Germanium (SiGe) BiCMOS process technologies, VectraWave can design high speed logic integrated circuits, as well as analogue mixed signal integrated circuits.
Our Design process
According to the requirements, we will adjust our process for fitting the application. Generally two design cycles, separated by the fabrication and characterization of the device, are necessary for adjusting and reaching the targeted specifications.
Technologies of packaging
Pending of the application and quantities, VectraWave will design and choose the best integrated circuit solution, and define in accordance to the requirement, the appropriate suppliers and sub-contractors for the production.
VectraWave packaging expertises include the Electromagnetic and thermal simulation for complex device.
RF packaging can be coupled to Optical packaging for communication, Avionic and space application.