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General Informations

We develop bare dies or MMIC solutions” up to 100GHz, using the best available processes in order to optimize cost, performances, power consumption and small form factor packaging

Die Format

QFN Package

Flange Package

Testing EVB

Our RF/Microwave products offer includes: MMIC (GaAs, GaN/SiC, GaN/Si ) for medium and high-power functions, Low Noise Amplifiers , using Surface Mount package technologies (QFN, Flanged, Lead Frame) as well as connectorized housings (SMA, K, GPPO, …)

Our range of MMIC products includes :