General Informations
We develop bare dies or MMIC solutions” up to 100GHz, using the best available processes in order to optimize cost, performances, power consumption and small form factor packaging
![](https://www.vectrawave.com/wp-content/uploads/2023/05/VWA5000068AAAA.jpg)
Die Format
![](https://www.vectrawave.com/wp-content/uploads/2023/05/VWA5000068AAAA-2.jpg)
QFN Package
![](https://www.vectrawave.com/wp-content/uploads/2023/05/VWA5000068AAAA-3.jpg)
Flange Package
![](https://www.vectrawave.com/wp-content/uploads/2023/05/VWA5000068AAAA-4.jpg)
Testing EVB
Our RF/Microwave products offer includes: MMIC (GaAs, GaN/SiC, GaN/Si ) for medium and high-power functions, Low Noise Amplifiers , using Surface Mount package technologies (QFN, Flanged, Lead Frame) as well as connectorized housings (SMA, K, GPPO, …)